SMC
2016

"Development of a Highly Linear Operational Transconductance Amplifier for a High-Q Bandpass Filter" M. Mader, J. Briem, M. Grözing, M. Berroth

Kleinheubacher Tagung, Miltenberg,
26. - 28. September 2016

"Design of a CMOS Readout Circuit on Ultra-thin Flexible Silicon Chip for Printed Strain Gauges" M. Elsobky, Y. Mahsereci, J. Keck, H. Richter,
J. Burghartz

Kleinheubacher Tagung, Miltenberg,
26. - 28. September 2016

"Micro-Hybrid System in Polymer Foil Based on Adaptive Layout" G. Alavi, H. Sailer, H. Richter, B. Albrecht,
M. AlShahed, C. Harendt, J. Burghartz

ESTC - 6th Electronics System-Integration Technology Conference, Grenoble, France,
13. - 16. September 2016

"A DC-coupled 27 MHz LNA and Automatic Gain Control on an Ultra-Thin 0.5 µm CMOS Gate Array for a Wireless Sensor-System-in-Foil" J. Briem, M. Grözing, M. Berroth

PRIME 2016, Lissabon, Portugal,
27. - 30. Juni 2016

"Ultradünne Hybride Foliensysteme -
die nächste Generation intelligenter und flexibler Foliensubstrate"
J. Kostelnik, A. Schreivogel, C. Harendt,
M. Hassan, S. Saller, J. Burghartz

Zeitschrift PLUS (Leuze Verlag),
Ausgabe 5, Mai 2016

"A 868 MHz Wireless Transmitter for a Sensor-System-in-Foil" J. Briem, M. Grözing, M. Berroth

GeMiC 2016, Bochum,
14. - 16. März 2016

"Komplexe Systeme in Folien – die nächste Generation intelligenter und flexibler Foliensubstrate" A. Schreivogel, J. Kostelnik, S. Saller,
J. Burghartz, C. Harendt, M. Hassan,
M. Fritzmann, J. Keck

Konferenz EBL 2016 "Elektronische Baugruppen und Leiterplatten", Fellbach,
16. - 17. Februar 2016

„An Ultra-Thin Flexi-ble CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper” Y. Mahsereci, S. Saller, H. Richter,
J. Burghartz

IEEE Journal of solid-state circuits, Vol. 51, No. 1, pp. 273-280, Januar 2016



2015

"Komplexe Systeme in Folie - Heterogene Systemintegration auf Basis dünner Si-Chips und flexibler Substrate" C. Harendt

Mikrosystemtechnik Kongress 2015,
Karlsruhe, 26. – 28. Oktober 2015

"SmartSkin - Eine intelligente Haut für adaptiv bionische Greifer" S. Saller, C. Harendt, J. Kostelnik, A. Schreivogel, Y. Mahsereci, J. Burghartz

Mikrosystemtechnik Kongress 2015, Karlsruhe, 26. – 28. Oktober 2015

"Combining Organic and Printed Electronics in Hybrid System in Foil (HySiF) Based Smart Skin for Robotic Applications" M. Hassan, J. Keck, H. Klauk, J. Kostelnik,
Y. Mahsereci, S. Saller, A. Schreivogel,
T. Zaki, J. Burghartz

EMPC 2015, Friedrichshafen,
14. - 16. September 2015

"Low-Temperature Refill Process for Through-Silicon-Vias (TSVs) in Stacked Ultra-Thin Chip-on-Wafer by Aerosol Jet Printed Silver" S. Ferwana, J. Keck, M. Hassan, C. Harendt,
J. Burghartz

EMPC 2015, Friedrichshafen,
14. - 16. September 2015

"Hybrid Systems in Foil (HySiF) Exploiting Ultra-thin Flexible Chips Solid-State Electronics" C. Harendt, J. Kostelnik, A. Kugler, E. Lorenz, S. Saller, A. Schreivogel, Z. Yu, J. Burghartz

Elsevier, vol. 113 (2015), pp. 101-108,
8. Juni 2015

"An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper" Y. Mahsereci, S. Saller, H. Richter,
J. Burghartz

ISSCC2015, San Francisco, USA,
22. - 26. Februar 2015
(ISSCC Digest of Technical Papers 2015,
pp. 1-3, ISBN: 978-1-4799-6223-5)

"Organic Thin-Film Transistors: Flexible Low-Voltage Organic Complementary Circuits: Finding the Optimum Combination of Semiconductors and Monolayer Gate Dielectrics" U. Kraft, M. Sejfic, M. Kang, K. Takimiya,
T. Zaki, F. Letzkus, J. Burghartz, E. Weber,
H. Klauk

Advanced Materials, Volume 27, Issue 2, Januar, 2015



2014

"Bias-stress stability of low-voltage p-channel and n-channel organic thin-film transistors on flexible plastic substrates" S. Bisoyi, U. Zschieschang, M. Kang,
K. Takimiya, H. Klauk, S. Tiwari

Organic Electronics, Volume 15, Issue 11, November 2014

"Hybride flexible Systeme in Folie - Möglichkeiten für Drucktechnologien" C. Harendt

MST-BW, Fachgruppe Drucktechnologien, November 2014

"Integrated Circuits Using Oxygen Barrier Stabilized Oxide TFTs" M. Herrmann, N. Frühauf SID-ME Fall Meeting 2014, Stuttgart,
9. - 10. Oktober 2014
"Thermal Investigations and Modeling of Ultra-thin Si Chips " M. Alshahed, Z. Yu, H. Rempp, H. Richter,
C. Harendt, J. Burghartz
44th European Solid-State Device Research Conference (ESSDERC), Venedig, Italien, 26. September 2014
"Hybrid Systems in Foil (HySiF) Exploiting Ultra-thin Flexible Chips" H. Richter, J. Burghartz, M. Berroth,
N. Frühauf, C. Harendt, J. Hesselbart,
G. Hübner, H. Kück, H. Klauk, J. Kostelnik,
R. Rupp, S. Saller
44th European Solid-State Device Research Conference (ESSDERC), Venedig, Italien, 24. September 2014
"Oxide Semiconductor Thin-Film Transistors Using Oxygen Barriers and a Wet-Chemical Back-Channel Etch Step" M. Herrmann, N. Frühauf SID International Symposium 2014, SID Digest, Juli 2014
"Smart Skin for Robotics – an example of a Complex System-In-Foil" C. Harendt, Z. Yu, J. Burghartz, J. Kostelnik,
A. Kugler, S. Saller
6th International Exhibition and Conference for the Printed Electronics Industry (LOPEC), München, 27. Mai 2014

"Smarte Technologien im Verbundprojekt KoSiF"

S. Saller MST-BW, Fachgruppe, Mai 2014
"Ultra-thin Silicon Chips in Flexible Microsystems" J. Wolf, J. Kostelnik, K. Berschauer,
A. Kugler, E. Lorenz, T. Gneiting, C. Harendt,
Z. Yu
13th Electronic Circuits World Convention (ECWC13), Nürnberg, 7. - 9. Mai 2014
"Integrated Circuits Using Oxygen Barrier Stabilized Oxide TFTs" C. Harendt, Z. Yu, J. Burghartz, J. Kostelnik,
A. Kugler, S. Saller
6th International Exhibition and Conference for the Printed Electronics Industry (LOPEC), München, 27. Mai 2014
"IGZO TFTs with Anodized Aluminum Oxide Dielectric for Flexible Electronics" A. Mehadi, M. Herrmann, H. Baur, N. Frühauf SID-ME Spring Meeting 2014, Istanbul, Türkei, 7. - 8. April 2014
"A New MOSFET Model for the Simulation of Circuits under Mechanical Stress" H. Alius, H. Rempp, Z. Yu, T. Gneiting Modeling of Systems and Parameter Extraction Working Group (MOS-AK), London, Grossbritanien, 28. - 29. März 2014
"Gate Dielectric for Low Temperature IGZO TFT Fabrication" A. Mehadi, M. Herrmann, P. Schalberger
N. Frühauf
Electronic Displays Conference 2014, Nürnberg, 25. - 27. Februar 2014


2013

"High-mobility organic thin-film transistors based on a small-molecule semiconductor deposited in vacuum and by solution shearing" R. Hofmockel, U. Zschieschang, U. Kraft,
R. Rödel, N. Hansen, M. Stolte, F. Würthner,
K. Takimiya, K. Kern, J. Pflaum, H. Klauk

Organic Electronics, Volume 14, Issue 12, December 2013

"Assembly and Embedding of Ultra-Thin Chips in Polymers" M. Hassan, C. Schomburg, C. Harendt,
E. Penteker, J. Burghartz
European Microelectronics and Packaging Conference, Grenoble, Frankreich,
9. September 2013

"Make Way for Flexible Silicon Chips"

J. Burghartz IEEE Spectrum, März 2013

"Sensorische Folien - Das Forschungs-projekt KoSiF"

J. Burghartz Computer & Automation, März 2013